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DATA SHEET
MOS INTEGRATED CIRCUIT
PD16510
VERTICAL DRIVER FOR CCD SENSOR
The PD16510 is a vertical driver dedicated for CCD area image sensors that incorporates a level conversion circuit and a three-level output function. It contains a CCD vertical register driver (4 channels) and a VOD shutter driver (1 channel). The PD16510, which uses the CMOS process, provides optimum transmission delay and output ON resistance characteristics for the vertical drive of CCD sensors. It can be used for low-voltage logic (logic power-supply voltage: 2.0 to 5.5 V).
FEATURES
* CCD vertical register driver : 4 channels, VOD shutter driver: 1 channel * Small package * High breakdown voltage * Low output ON resistance * Latch-up free * Pin-compatible with PD16506 (CCD driver) : 20-pin plastic shrink SOP (225 mil) : 33 V MAX. : 30 TYP.
* Low voltage operation (logic power-supply voltage: 2.0 to 5.5 V)
APPLICATIONS
* Camcorders
ORDERING INFORMATION
Part Number Package 20-pin plastic shrink SOP (225 mil)
PD16510GR-8JG
The information in this document is subject to change without notice. Document No. S12191EJ2V0DS00 (2nd edition) (Previous No. IC-3448) Date Published May 1997 N Printed in Japan
The mark
shows major revised points.
1994
PD16510
BLOCK DIAGRAM
Vsb VDD1 VSS TI1
20 16 VDD1 2 7 VDD2a Three level VSS
4
VDD2a
19 VDD2b
5
TO1
PG1 BI1
8 Two level 9 Input interface (2.0 to 5.5 V) VDD1
VDD2b 3 VSS VDD2a Three level 17 TO2 BO1
TI2 PG2 BI2
14 13 12
VSS VDD2b Two level 18 BO2 VSS Vsb Two level 1 VSS SUBO
SUBI NC
10 11
VCC
6
GND
15
2
PD16510
PIN CONFIGURATION
20-pin plastic shrink SOP (225 mil)
SUBO VSS BO1 VDD2a TO1 VCC TI1 PG1 BI1 SUBI
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
Vsb VDD2b BO2 TO2 VDD1 GND TI2 PG2 BI2 NC
Remark
The PD16510 is pin-compatible with the PD16506 (CCD driver). However, the VOD shutter drive pulse input polarity switching pin (SSP) of the PD16506 corresponds to the GND pin in the PD16510 (pin 15).
PIN FUNCTIONS
No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol SUBO VSS BO1 VDD2a TO1 VCC TI1 PG1 BI1 SUBI NC BI2 PG2 TI2 GND VDD1 TO2 BO2 VDD2b Vsb I/O O - O - O - I I I I - I I I - - O O - - Ground VH power supply Three-level pulse output Two-level pulse output VMb (Two-level driver) power supply VHH (for SUB drive) power supply Two-level driver input (See Functions table on p. 4) VOD shutter drive pulse input Non connect Two-level driver input (See Functions table on p. 4) Three-level driver input (See Functions table on p. 4) Pin Function VOD shutter drive pulse output VL power supply Two-level pulse output VMa (Three-level driver) power supply Three-level pulse output Logic power supply Three-level driver input (See Functions table on p. 4)
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PD16510
FUNCTIONS
VL = VSS, VMa = VDD2a, VMb = VDD2b, VH = VDD1, VHH = Vsb Pin TO1
Input TI1 L L H H PG1 L H L H VH VMa VL Output (TO1) TI2 L L H H
Pin TO2
Input PG2 L H L H VH VMa VL Output (TO2)
Pin BO1
Input BI1 L H VMb VL Output (BO1)
Pin BO2
Input BI2 L H VMb VL Output (BO2)
Pin SUBO
Input SUBI L H VHH VL Output (SUBO)
Usage Caution
Because the PD16510 contains a PN junction (diode) between VDD2 VDD1, if the voltage is VDD2 > VDD1, an abnormal current will result. Therefore, apply power in the sequence VDD1 VDD2, or apply power simultaneously to VDD1 and VDD2.
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PD16510
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = 25 C, GND = 0 V)
Parameter Power supply voltage Power supply voltage Power supply voltage Power supply voltage Input voltage Operating ambient temperature Storage temperature Power dissipation Symbol VCC VDD1 VDD2 Vsb VI TA Tstg Pd TA = 85 C Conditions Rating VSS-0.3 to VSS+20.0 VSS-0.3 to VSS+33.0 VSS-0.3 to VSS+33.0 VSS-0.3 to VSS+33.0 VSS-0.3 to VCC+0.3 -25 to +85 -40 to +125 260 Unit V V V V V C C mW
Caution
Exposure to Absolute Maximum Rating for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently.
RECOMMENDED OPERATING CONDITIONS (TA = 25 C, GND = 0 V)
Parameter Power supply voltage Power supply voltage Power supply voltage Power supply voltage Power supply voltage Power supply voltage Power supply voltage Input voltage, high Input voltage, low Operating ambient temperature Symbol VCC VDD1 VDD1-VSS VDD2a VDD2b VSS Vsb-VSS VIH VIL TA -0.8 VCC 0 -20 Note Note Note Conditions MIN. 2.0 10.5 20.5 -1.0 -1.0 -10.0 15.0 TYP. MAX. 5.5 21.0 31.0 +4.0 +4.0 -6.0 31.0 VCC 0.3 VCC +70 Unit V V V V V V V V V C
Note Set the values of VDD1 and VSS to conform to VDD1-VSS specification value.
5
PD16510
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, VDD1 = +15 V, VDD2a = 0 V, VDD2b = +1.0 V, Vsb = +21.5 V, VCC = +2.5 V, VSS = -7.0 V, TA = 25 C, GND = 0 V)
Parameter Output voltage, high Output voltage, middle Output voltage, middle Output voltage, low Output voltage, sub high Output voltage, sub low Output ON resistance Output ON resistance Output ON resistance Output ON resistance Transmission delay time 1 Transmission delay time 2 Transmission delay time 3 Rise/Fall time 1 Rise/Fall time 2 Rise/Fall time 3 Consumption Current Consumption Current Consumption Current Consumption Current Consumption Current Symbol VH VMa VMb VL VsubH VsubL RL RM RH Rsub TD1 TD2 TD3 TP1 TP2 TP3 ICC IDD2a IDD2b lDD1 Isb See Figure 1. Output Load Circuit. See Figure 3. Input Waveform. 0.5 3.0 3.0 1.5 1.2 See Figure 1. Output Load Circuit. See Figure 2. Timing Chart. No load, see Figure 2. Timing Chart. IO = -20 A IO = 20 A IO = 10 mA IO = 10 mA IO = -10 mA IO = 20 A IO = -20 A Conditions MIN. VDD1-0.1 VDD2a-0.1 VDD2b-0.1 VSS+0.1 Vsb-0.1 VSS+0.1 20 30 30 30 TYP. MAX. VDD1 VDD2a VDD2b VSS Vsb VSS 30 45 40 40 200 200 200 500 500 200 1.0 5.0 5.0 3.0 1.8 Unit V V V V V V ns ns ns ns ns ns mA mA mA mA mA
Figure 1. Output Load Circuit
2000 pF 1000 pF TO1 3000 pF 1000 pF BO1 2000 pF
2000 pF BO2 3000 pF TO2 2000 pF SUBO 1600 pF
6
PD16510
Figure 2. Timing Chart
BI1, BI2 TI1, TI2
TD1
TD1
BO1, BO2 TO1, TO2
VMb VMa
VL TP1 TP1
PG1, PG2
TD2
TD2
VH TO1, TO2 VMa TP2 TP2
SUBI
TD3
TD3
VHH SUBO VL TP3 TP3
7
PD16510
Figure 3. Input Waveform Input pulse timing diagram
63.5 s 2 s
127 s
Tl2 Tl1 Bl1
Bl2
PG1 2.5 s PG2 2 s SUBI 63.5 s
2.5 s
16.7 ms
Overlap section enlarged diagram
Tl1
Bl1
Tl2
Bl2
0
0.7
1.4
2.1
2.8
3.5
4.2
4.9 s
8
PD16510
APPLICATION CIRCUIT EXAMPLE
VSS VCC
Vsb
VDD1
VSUB (substrate voltage)
CCD 0.1 F SUB 1 M 1 0.1 F 2 3 4 SSG 5 SUB TG V1 V2 V3 V4 8 9 PG1 Bl1 PG2 Bl2 NC 13 12 11 0.1 F 6 7 TO1 VCC Tl1 VSS BO1 VDD2a VDD2b BO2 TO2 19 V1 18 17 16 15 14 V2 V3 V4 VDD1 GND Tl2 0.1 F SUBO Vsb 20 0.1 F
PD16510
10 SUBI
9
PD16510
PACKAGE DRAWING
20 PIN PLASTIC SHRINK SOP (225mil)
20 11
detail of lead end
1 A
10
H I J
F
G
E
N C D M
M
B
K
L
NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.
ITEM A B C D E F G H I J K L M N P
MILLIMETERS 7.00 MAX. 0.575 MAX. 0.65 (T.P.) 0.22 +0.10 -0.05 0.10.1 1.45 MAX. 1.150.1 6.40.2 4.40.1 1.00.2 0.15 +0.10 -0.05 0.50.2 0.10 0.10 3 +7 -3
P
INCHES 0.276 MAX. 0.023 MAX. 0.026 (T.P.) 0.009 +0.004 -0.003 0.0040.004 0.057 MAX. 0.045 +0.005 -0.004 0.2520.008 0.173 +0.005 -0.004 0.039 +0.009 -0.008 0.006 +0.004 -0.002 0.020 +0.008 -0.009 0.004 0.004 3 +7 -3 P20GR-65-225C-1
10
PD16510
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Surface mount device
PD16510GR-8JG: 20-pin plastic shrink SOP (225 mil)
Process Infrared ray reflow Conditions Peak temperature: 235 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 3 times. Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 3 times. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Pin temperature: 300 C or below, Heat time: 3 seconds or less (Per each side of the device). Symbol IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating method
--
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress.
11
PD16510
[MEMO]
12
PD16510
[MEMO]
13
PD16510
[MEMO]
14
PD16510
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
15
PD16510
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96.5

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